Atomic and Electronic Structure Analysis/
Trace Elements Analysis
Items labeled
can be shared by non-NIMS users. For details, please refer to the related links in the description column of each equipment/facility.800 MHz wide bore Solid-State NMR System
800 MHz wide bore Solid-State NMR System
High-field (18.79T) wide-bore high-resolution NMR system specialized for solid materials, which provides structural analyses for various kinds of solid materials as they are. The system is equipped with state-of-the-art NMR technology to meet the needs of various material researchers developing cutting-edge materials.
Analysis system for probing local chemical-bonding states
Analysis system for probing local chemical-bonding states
A transmission electron microscope with the highest energy resolution in Japan enables spectroscopic imaging of chemical bonding states, dielectric properties, and lattice vibrations on the atomic to nano scale. Equipped with highly sensitive detectors, it is also capable of mapping trace elements and observing the structure of organic materials.
Scanning Hard X-ray Photoelectron Spectroscopy
Scanning Hard X-ray Photoelectron Spectroscopy
Two types of X-ray sources (Cr Kα, Al Kα) are available, enabling bulk analysis with a detection depth of about 20 nm with minimal influence of surface oxidation or contamination of the sample. It also supports depth analysis of organic materials using a gas cluster ion gun, non-exposure to air measurements, bias-applied measurements on samples under heating or cooling condition, and operando measurements.
Hard X-ray Photoelectron Spectroscopy (HAXPES)
Hard X-ray Photoelectron Spectroscopy (HAXPES)
HAXPES uses hard X-rays to precisely detect surface elements from depths of 10 nm or greater, and the focused Cr Kα beam enables deeper analysis than XPS. In addition, the system is directly connected to an argon atmosphere glove box, allowing samples to be transported without exposure to the atmosphere. Operando measurements for next-generation batteries are also available.
Magnetic Sector Secondary Ion Mass Spectrometry : IMS-4f
Magnetic Sector Secondary Ion Mass Spectrometry : IMS-4f
This system can perform highly accurate and sensitive analysis including isotopes from hydrogen to uranium. It is mainly used for the analysis of samples treated with hydrogen isotope and oxygen isotope. The sample temperature during the analysis can be selected between room temperature and liquid nitrogen temperature.
Magnetic Sector Secondary Ion Mass Spectrometry : NanoSIMS 50
Magnetic Sector Secondary Ion Mass Spectrometry : NanoSIMS 50
This instrument is specialized for the acquisition of high-resolution images including isotopes from hydrogen and uranium. It is mainly used for the analysis of hydrogen isotope and oxygen isotope treated samples, as well as for observing the solid solution of additives.
Proton Transfer Reaction Time-of-flight Mass Spectrometer (PTR-TOF-MS)
Proton Transfer Reaction Time-of-flight Mass Spectrometer (PTR-TOF-MS)
This is an ultra-sensitive gas analyzer capable of measuring trace gas components down to ppt (parts per trillion) concentration in real time. It measures gases emitted from humans, animals, plants, and bacteria (such as breath, skin gas, and urine gas) and contributes to the research and development of olfactory sensors aimed at non-invasive diagnostics and non-contact inspections.
Imaging-type spin-resolved photoemission microscopy
Imaging-type spin-resolved photoemission microscopy
This machine achieves a spatial resolution of 30 nm in photoemission spectroscopy. Imaging technique reduces the measurement time of spin-resolved photoemission spectroscopy by more than four orders of magnitude compared to conventional machines. It contributes to the development of materials and devices by visualizing the electronic states in nano scale, which has been difficult with conventional photoemission spectroscopy.
- Microscope
- Atomic and Electronic Structure Analysis/ Trace Elements Analysis
- Physical Properties Measurement
- Sample Preparation and Synthesis
- Materials Forming and Machining
- Material Design Support
- Facility