NIMS Signs MOU with NYCU and TSRI, Taiwan
2025.05.29
On May 22, 2025, NIMS signed a Memorandum of Understanding (MOU) for research collaboration in the field of advanced semiconductors with National Yang Ming Chiao Tung University (NYCU) and the Taiwan Semiconductor Research Institute (TSRI, National Institutes of Applied Research), Taiwan.
Dr. Hono, President of NIMS, visited NYCU in Hsinchu, Taiwan, and attended the signing ceremony of the MOU together with Prof. Jack Sun, Senior Vice President of NYCU, and Prof. Tuo-Hung Hou, Director General of TSRI. Following the signing ceremony, a trilateral workshop was held, where each institution introduced its organizational overview and ongoing initiatives in semiconductor research. The event provided a valuable opportunity for meaningful exchanges toward strengthening future collaborations.
It is expected that the research collaboration in the field of advanced semiconductors will be further stimulated and strengthened through this MOU.
Signing Ceremony
Commemorative photo at the signing ceremony
From left, Prof. Sun, Senior Vice President of NYCU, Dr. Hono, President of NIMS, and Prof. Hou, Director General of TSRI
Commemorative group photo
