About Smart Interface Team
Reversible interconnection for future quantum electronics system
In the recent automotive IoT (Internet of things) based on 5G/6G, heterogeneous materials must be integrated seamlessly from the near-future quantum devices to 3D ultra-high-density wiring and the structural materials, which crosses the fabrication scale from nm to um. In addition, in response to social demands for green technology, a solid-state detachment of materials, according to their different lifetimes, is inevitable. We are working on creating surface/interface which are effective both in bonding and debonding by modifying the chemical/physical nanostructures via diverse approaches; 1) beam-induced semiconductor fabrication processes, and 2) bio-mimetic fabrication/nucleation. The incorporation of bonding and debonding in a single process will be of practical use. We contribute to the construction of low-loss and high-performance quantum electronics systems that utilize novel structures and materials.
Area of expertise / research subject
We are developing a novel reversible adhesion technology that achieves both robust bonding and easy debonding across diverse materials and scales. By employing a hybrid photo-plasma method, we are creating functional ultra-thin bridge layers through radical species generated in a nitrogen atmosphere.
This approach enables high-performance system integration with multifunctional interfaces. By incorporating mechanisms for simple solid-phase separation, we aim to establish a system integration process that contributes to a circular economy.
Team Members
