Some of major facilities are shown here. For further information, please see the following webpage.
| Deposition systems | ||
|---|---|---|
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| Ultrahigh vacuum sputtering cluster (1): Fully automated robot transfer | Ultrahigh vacuum sputtering cluster (2): Manual transfer | Ultrahigh vacuum sputtering cluster (3): Automated robot + manual transfer |
| Deposition systems | |
|---|---|
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| Sputtering system | Sputtering system (4 targets) |
| Microfabrication Equipments | ||
|---|---|---|
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| Electron beam lithography (CMSM center system) | Mask aligner | Ar ion milling |
| Vacuum furnaces with electromagnets | |
|---|---|
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| Small（Max field：0.2 T) | Large (Max field：0.7 T) |
| Characterization tools | ||
|---|---|---|
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 |
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| VSM (Vibrating sample magnetometry) | SQUID-VSM | High field Micro-Kerr |
| Characterization tools | ||
|---|---|---|
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| High frequency prober | Automatic prober | CIPT (TMR wafer measurement system) |
| Characterization tools | ||
|---|---|---|
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| AFM (atomic force microscope) | 3D magnetic field prober | Small PPMS |
