UHV sputtering deposition system which has two sputtering chambers connected by the transfer chamber. Maximum 18 source can be deposited without air exposure in this system. High quality giant magnetoresistive device made by this system successfully realized the highest record of magnetoresistive property in the world.

5 Targets Magnetron Sputtering Machine
The electron beam lithography, which focus the highly accelerated electron and draw nano-scale pattern on resists, is an indispensable tool for testing new spintronics materials in actual device scale. Our equipment, JBX-6300 SM, can easily draw wire patterns down to 7 nm in width, due to the benefit of the highly acceleration voltage upto 100 kV. Fine correction functions enables semi-automatic exposure with high accuracy.

Mask Aligner

Mask Aligner

Ar Ion Milling Machine
Titan G2 80-200 S/TEM(FEI) can be operated at 80-200 kV. Cs correction make electron probe much smaller, and it enables the microscope to get a higher-resolution(below 0.08nm). The microscope also support chemical analysis such as EELS(Electron Energy-Loss Spectroscopy), EDS(Energy Dispersive x-ray Spectroscopy) with atomic level resolution.
FIB(Focused Ion Beam) and SEM(Scanning Electron Microscope) combined system with cryo-stage. Preparation of TEM/3DAP samples at low temperature(~around 100K) is available in the machine. In addition, it supports automated FIB fabrication and SEM observation by using Python-based API. Also, transferring 3DAP samples between FIB-SEM and 3DAP machine kept at low temperature and without air exposure is possible by using VCTM(Vacuum and Cryo Transfer Module).
FIB(Focused Ion Beam) and SEM(Scanning Electron Microscope) combined system with a femtosecond laser. Large ROI can be milled by the femtosecond laser, then finely polished by the FIB and observed by SEM. It also supports EDS(Energy Dispersive x-ray Spectroscopy). In addition, preparation of TEM and 3DAP samples by standard lift-out method is possible.
FIB(Focused Ion Beam) and SEM(Scanning Electron Microscope) combined system. In the system, SEM observation, preparation of TEM and 3DAP samples by standard lift-out method are possible. In addition, it supports EDS(Energy Dispersive x-ray Spectroscopy) and EBSD(Electron BackScatter Diffraction) analysis.
The 3D atom probe method can detect and identify the position of single atoms including light elements, which are difficult to observe with electron microscopes. It is also very effective in analyzing the distribution of elements within a variety of materials or devices.
The LEAP5000XS is a high performance atom probe microscope which provides nano-scale surface, bulk and interfacial materials analysis of simple and complex structures with atom-by-atom identification and accurate spatial positioning.
The system works using the principle of field evaporation, whereby a strong electric field applied to the specimen is sufficient to cause removal of atoms by ionization. Atom removal is triggered either via a voltage or laser pulse applied to the sample. (from the CAMECA's website.)
Three-dimensional Atom Probe assisted with femtosecond laser pulse. It can analyze wide variety of materials including metals, semiconductors and their devices, ceramics. With shorter flight distance(~12cm), a large angle of view can be achived.
In addition, the development of the microfabrication method using FIB technique makes site specific atomprobe specimen preparation possible, such as grain boundaries, specific region of devices.
In addition, the development of the microfabrication method using FIB technique makes site specific atomprobe specimen preparation possible, such as grain boundaries, specific region of devices.

Lake Shore
VSM 7410
VSM 7410

XRF(X-ray Fluorescence) Machine
Rigaku ZSX Primus Ⅱ
Rigaku ZSX Primus Ⅱ

Point Contact Andreev Reflection Meausurement System

Vibrating Sample Magnetometer(VSM)

High Sensitive VSM

Differential Thermal Analysis

SQUID-VSM

High-field Micro-Kerr Effect Measuring Equipment

XRD(X-ray diffraction) Machine
Rigaku SmartLab
Rigaku SmartLab

Scanning Electron Microscope

Physical Property Measurement System

Current In Plane Tunnelling

Small ElectroMagnet

Instron Tensile Test Machine

Arc Saction Casting Machine

Arc Melting Furnace

Single Roll Melt Spinner

Vacuum Induction Furnace

Planetary Ball Mill

Vacuum Glove Box

Hydraulic Press Equipment in a Magnetic Field Forming

Infrared Furnace