In the recent automotive IoT (Internet of things) based on 5G/6G, heterogeneous materials must be integrated seamlessly from the near-future quantum devices to 3D ultra-high-density wiring and the structural materials, which crosses the fabrication scale from nm to um. In addition, in response to social demands for green technology, a solid-state detachment of materials, according to their different lifetimes, is inevitable. We are working on creating surface/interface which are effective both in bonding and debonding by modifying the chemical/physical nanostructures via diverse approaches; 1) beam-induced semiconductor fabrication processes, and 2) bio-mimetic fabrication/nucleation. The incorporation of bonding and debonding in a single process will be of practical use. We contribute to the construction of low-loss and high-performance quantum electronics systems that utilize novel structures and materials.

Reversible adhesion, which can be easily combined with separation and is applicable to different materials and processing scales, is achieved by controlling the surface nano/microstructure through completely different approaches of optical surface modification and biomimetic technologies. In the optical approach, ultra-thin bridge layers are formed by utilizing the action of radical species generated by vacuum ultraviolet light irradiation in an atmospheric nitrogen atmosphere containing various solution vapors. In biomimetic technology, we are developing new adhesion method by developing new biomimetics that mimic not only the morphology but also the nucleation process of various structures of living organisms that utilize "adhesion and detachment" in nature.