CAMECA EIKOS-UV
* "EIKOS-X" has been upgraded to "EIKOS-UV" in January, 2020.
The fully configured EIKOS-UV system combines all the outstanding features of the base EIKOS (voltage pulsed, reflectron based functionality, prealigned counter electrode) and adds a fully integrated 355nm laser pulsing module with computer controlled focused spot design to provide access to a larger application range.
CAMECA LEAP5000XS
The LEAP 5000 XS combines new flight path technology with enhanced detector performance to offer improved field of view whilst achieving unprecedented detection efficiency ~ 80%, the highest of any such analytical technique! In addition, the advanced laser pulse module capable of offering repetition rates of up to 2 MHz makes the LEAP 5000 XS the ultimate in efficiency and productivity.
FEI HeliosG4
FIB(Focused Ion Beam) and SEM(Scanning Electron Microscope) combined system. The development of the microfabrication method using the focused ion beam (FIB) technique makes site specific 3DAP specimen preparation possible, such as grain boundaries, interphase interfaces, specific region of devices, nanowires etc..
