Research Topics 2011

Ultra-fast Forming Organic Conductive Material

-For low cost 3D micro wiring in advanced electronics-

September 21, 2011

This research was conducted by
Jin Kawakita and Toyohiro Chikyow

We succeeded in developing a conductive material for a micro wiring in electronics which can be formed with the growth rate of 10 times or more, compared with the current technology. Both injection of the precursors in a liquid state and subsequent formation of a conductive material can be done fast. It is expected by this result that the filling time of TSV (Through Silicon Via) in the 3D semiconductor as one of the advanced electronic technologies will be shortened from several hours in a few minutes.

fig. 1

Figure 1. Formation process of conductive polymer / metal composite

fig. 2

Figure 2. Schematic illustration of 3D semiconductor with TSV (Through Silicon Via) technology

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