Next-generation Edge AI Semiconductor Research & Development Project

External Project

Research and Development of Next-Generation Edge AI Semiconductors for Social Implementation

  • JST Project
  • Project Leader: Munehiro Tada (Keio University)
  • Next-Generation Edge AI Semiconductor Research and Development Project

As AI technology advances, demand for edge AI—which performs real-time processing on devices—is growing rapidly. However, achieving this requires ultra-low-power semiconductors that do not rely on the cloud. This initiative was launched as a national project led by the Ministry of Education, Culture, Sports, Science and Technology (MEXT) and the Japan Science and Technology Agency (JST) to address these societal challenges.

NIMS is participating in “Theme 3: Next-Generation Transistor Technology,” working to develop next-generation channel materials using 2D semiconductors and oxide semiconductors, explore new wiring materials, and establish a manufacturing platform for CFETs (Complementary FETs). Leveraging its expertise in materials science, NIMS aims to establish core technologies with a view toward societal implementation in the 2030s.

Next-generation Transistor Technology

Next-generation Channel
Materials: 2D Semiconductors, Oxide Semiconductors

NIMS Participants
  • Yasumitsu Miyata (Co-PI)
  • Ryo Kitaura
  • Ryotaro Sakakibara
  • Takahiro Nagata

New Wiring Materials

NIMS Participants
  • Tomoya Nakatani (Co-PI)
  • Yuya Sakuraba
  • Taisuke Sasaki
  • Ryoji Sahara
  • Hirofumi Suto

CFET Manufacturing Infrastructure

NIMS Participants
  • Takuji Hosoi (Co-PI)
  • Shinjiro Hara
  • Tomoya Nakatani
  • Taisuke Sasaki
  • Takahiro Nagata
  • Yoshiyuki Yamashita
  • Naoka Nagamura

Advanced semiconductor processing facility

  • Electron Beam Lithography
  • Automated coating, developing, and baking ssystem
  • Spin Etcher
  • Supercritical Cleaning and Drying System
  • Silicon PECVD System
  • SiN PECVD Equipment
  • Atomic Layer Deposition
  • Reactive Ion Etching
  • Atomic Layer Etching
  • Isotropic Dry Etcher
  • Chemical Mechanical Polishing (CMP)
  • Wafer Bonding
  • Laser Debonding System
  • Metal Organic Chemical Vapor Deposition
  • Scanning Electron Microscope
  • Confocal Near-Infrared Microscope