Fully Automated Ultra-High Vacuum Chamber Cluster Deposition System

This system is a fully automated ultra-high vacuum chamber cluster deposition system operable via PC. A robot transfer mechanism automatically transports substrates from the load lock chamber to each deposition chamber. Creating a deposition recipe for each chamber enables automatic thin film fabrication based on those settings. In addition to 10-target sputtering and co-sputtering, it enables various physical vapor deposition (PVD) methods including electron beam evaporation (EB) and molecular beam epitaxy (MBE). Substrate temperatures during deposition can be set up to 800°C (1000°C in MBE chamber), supporting thin film fabrication for a wide range of materials.