張 東宇 / Tommy

張 東宇 / 大学院生 (ICGP)

Research Interests:
SOFC interconnect alloys, High temperature oxidation, Additive manufacturing, Low-SFE alloys,
Transmission Electron Microscopy

Education
2026 - Present Double Degree Ph.D. Student, Department of Materials Science, Tohoku University, Japan
2025 - Present Ph.D. Student, Department of Materials Science and Engineering, National Tsing Hua University, Taiwan
2024 - 2025    M.S. in Materials Science and Engineering, National Tsing Hua University, Taiwan
2020 - 2024    B.S. in Materials Science and Engineering, National Tsing Hua University, Taiwan

Awards and Honors
2025　Best Poster Award, MSSp2025 International Symposium, Tohoku University
2025　Recipient of National Science and Technology Council (NSTC) Graduate Research Fellowship
2024　Phi Tau Phi Honor Society Member
2023　Recipient of Mei Yi-Chi Memorial Scholarship, National Tsing Hua University