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Wafer scribing system |
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Product |
DPS-301R |
Manufacturer |
Daitron Technology Co.,Ltd. |
Capabilities |
Method: diamond point scribe
Accuracy:
X,Y stage driving: 1um
X, Y scribe pitch: ±2um
Positioning: X: ±5um/100mm, Y: 10um/100mm
Moving area: X: 110mm (5-phase stepper motor), Y: 110mm (AC servo motor)
Cutter load: 10 ～ 30g
Sample stage: 175mmφ
Maximum substrate sizes: 4” wafer
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Wafer breaking system |
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Product |
DBM-401R |
Manufacturer |
Daitron Technology Co.,Ltd. |
Capabilities |
Method: blade pressing on substrate backside
Accuracy:
X,Y stage driving: 1um
X, Y scribe pitch: ±2um
Positioning: Y：10um/110mm
Moving area: Y:110mm (stepper motor)
Blade width: 80mm
Sample stage: 194mmφ
Maximum substrate sizes: 4” wafer
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Chemical mechanical polishing(CMP) system |
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Product |
PM5 |
Manufacturer |
Logitech |
Capabilities |
Plate rotating speed: 1 ～ 70rpm
Plate size: 12”
Plate material: glass, iron
Maximum substrate sizes: 3” wafer
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Manual probe system |
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Product |
MX-200/B (Prober), B1500A (Analyzer) |
Manufacturer |
Vector Semiconductor Co., Ltd. (Prober), Agilent Technologies Inc. (Analyzer) |
Capabilities |
MX-200/B
Probe: coaxial probe (4 probes)
Manipulator moving area: X, Y, Z： less than 7.5 mm
Manipulator accuracy: 0.01mm
Stage moving area: X: 100mm, Y:150mm, θ：±30°
Positioning accuracy: less than 10um
Substrate sizes: 5mm square ～ 100mmφ
B1500A
I-V measurement: 4 Source-Measure Units (SMUs)
C-V measurement: 1 Capacitance-Measure unit (CVU)
Ground unit: 1 unit
Maximum applied voltage: 200V
Applied voltage resolution: 5uV
Maximum measured current: 100mA
Measured current resolution: 0.1fA
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Cryogenic probing station system |
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Product |
[Cryogenic probing station] GRAIL10-308-6-4K-LV-SCM
[Semiconductor parametric analyzer] 4200-SCS
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Manufacturer |
Nagase Techno-Engineering Co., Ltd.
Keithley Instruments Inc. |
Capabilities |
Cryogenic probing station
Sample cooling system: Mechanical cooling (No refrigerant)
Temperature range: from 5K to room temperature
Probe: coaxial probe (6 probes) + sample stage
Current noise: < 100fA
Leak current: < 100fA
Sample size: < 20 mm square
Superconducting Magnet (SCM) cooling system: Liquid Helium flow
Magnetic field direction: Vertical direction to sample surface
*To use SCM system, please prepare LHe by yourself.
Semiconductor parametric analyzer
I-V measurement: 6 Source-Measure Units (SMUs) with PreAmp
C-V measurement: 1 Capacitance-Measure unit (CVU)
Ground unit: 1 unit
Maximum voltage: 200V
Applied voltage resolution: 5uV
Maximum measured current: 100mA
Measured current resolution: 0.1fA |
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Wire bonder |
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Product |
MODEL 7476D |
Manufacturer |
West·Bond, Inc. |
Capabilities |
Angled-feed (45°) or vertical-feed wedge bond methods
Wire material: Al, Au
Ultrasonics: Maximum 4W
Manipulator: single lever X-Y-Z micromanipulator
Bond force range: 18 ～ 90g
Holder temperature: RT ～ 300 degree C
Maximum substrate sizes: 50mm square, dual inline package(DIP)
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Diamond wire-saw |
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Product |
CS-203 |
Manufacturer |
Musashino Denshi, Inc. |
Capabilities |
Wire type: Wire tool with electrodeposited diamond grains
Wire diameter: 200um
Cooling: Water cooling system
Maximum substrate sizes: 100mm square
Example of the application: glass, quartz, ceramics, semiconductor materials, etc.
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