Quantum Materials - 24

Abstract

The integration of high-speed, low-loss heterogeneous signals is a crucial necessity for the advancement of Internet of Things (IoT) applications. The incorporation of superconducting or quantum devices is a pivotal aspect in this regard. It is inevitable that novel materials and conventional semiconductor materials will be bonded seamlessly with high reliability. Furthermore, a solid-state debondability must be established for the hybrid system design. For this, we developed an ultrathin bridge layer for hydrolysis-resistant hybrid bonding at temperatures below 150°C without vacuum through the use of the isopropyl alcohol vapor-assisted vacuum ultraviolet (IPA) method [1, 2]. In this method, the energy of the VUV and the radical species of H, OH, and CH generated by the decomposition of the IPA vapor were effective in eliminating surface organic impurities, deoxidizing the top surface of the native oxide, and subsequently forming the bridge layer. The bridge layer was constituted of alkyl chains with an inorganic carboxylate base with thickness of less than 10 nm. This structure plays a role in maintaining dynamic equilibrium of hydrolysis degradation, particularly in the case involving Cu interconnections, exhibiting the debondability due to the expansion of oxide nanocrystals at termperatures around -100℃．