Quantum Materials Field
Smart Interface Team
We create a reversible interconnection for next-generation semiconductor packaging, by a hybrid bonding including a trigger for solid-state debonding.
Group Leader: Akitsu Shigetou
The development of a vapor-assisted VUV surface modification method for heterogeneous bonding with solid-state debondability at low temperatures around TN.
Current Topics
It is important to design the physical and chemical structures of the interfaces based on the desired functions of an integrated system, including the hybrid bonds, such as solid-state debonding and waterproofing ability. We have developed several nm-thick bridge layers containing multidentate coordination metal carboxylates to significantly improve hydrolytic stability through optical surface treatment, and proposed chemical structures that can spontaneously generate nanocrystals that expand at low temperatures. In particular for Cu relating materials, we have realized an anti-hydrolysis bridge layer and found that the bond interface has capability of debonding at around -100C.
Outline of Research
We have realized the hybrid bonding at low temperatures and atmospheric pressure by creating ultra-thin bridge layers on the surfaces of semiconductor packaging materials using a vapor-assisted VUV method, and have significantly improved the interfacial reliability by tuning its chemical structure. By incorporating a mechanism of solid-state debonding into the bridge layer, which is based on the low temperature expansion of nanocrystals, an industrially simple chip replacement is expected to be realized in next-generation semiconductor system integration such as chiplet packaging.
Fig. 1. Outline of the vapor-assisted vacuum ultraviolet (V-VUV) surface modification method for hybrid bonding with interfacial reliability and debondability.
References
- A. Shigetou (NIMS exclusive application), Method for separating copper-copper laminate, and copper-copper laminate, JP 07597418 / WO2023286711A1 (2024).
- A. Shigetou, A much more simplified mixed signals integration; Frontiers of Materials Evolution NIMS Future Strategy [49], THE NIKKAN KOGYO SHIMBUN (2024).
Group members
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Akitsu Shigetou・team leader -
Naoe Hosoda・Chief Researcher
Links