A28:FIB-SEMNanoGREEN Bldg. E-108

A28:FIB-SEM

Maker

Hitachi High-Tech Science

Model

SMF2000

Use for

FIB processing, SEM/STEM observation, 3D image processing, EDS analysis, sample preparation for SEM/TEM.

Outline

The ion source of FIB is set perpendicular to the electron source of SEM. The specimen after FIB processing can be observed by SEM without moving the stage and 3D image acquired automatically. Low damage FIB processing is possible with a cryo-stage. Processing without air exposure is possible.

Specification

FIB

Ion source

Ga liquid metal ion source

Accelerating voltages

1,2,3kV 5 to 30 kV (in 5kV steps)

Area of the observation field

0.5 ㎛ x 0.5 ㎛ ~ φ2㎜

Image resolution

4.0nm (at 30kV)

Beam current

Up to 90nA

SEM

Electron source

Thermal Field Emission gun(ZrO/W)

Accelerating voltage

0.1 to 30kV (in 10kV steps)

Area of the observation field

0.125 ㎛ x 0.125 ㎛ ~ 2㎜x2㎜(10kV)

Image resolution

1.1nm(at 20kV) 1.5nm(at 10kV) 2.5nm(at 1kV) for SEM
0.8nm (at 30kV) for STEM

Beam current

Up to 10nA

Detector

STEM,BSE

Low accelerating voltage Ar ion

Ion source

Phillips Ionization Gauge(PIG) tpye ion source

Accelerating voltages

0.5 to 1kV

Beam current

Up to 10nA

Other

Detectors

EDS

Specimen Holder

The atmosphere blocking holder is available.

Notice

  • As this is an ultra-high vacuum instrument, samples containing volatile components that may contaminate the chamber cannot, in principle, be measured. Please consult us in advance regarding such samples. Samples containing sulfides cannot be measured.
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