Symposium C-2: "Soft Solution Processing"
Co-operated as Third International Symposium on Soft Solut ion Processing (SSP-2003)

Scope
The scope of the Symposium includes all of experimental and t heoretical works on Solution Processings and their products. Topics to be c overed are: Soft Chemistry (Chimie Douce), Intercalation, Ion-exchange, Chel ating, Sol-Gel, Polymerizable Complexes, Polymer Precursors, Hydrothermal, E lectrochemical, Electrodeposition, Photochemical, Sonochemical, Self-Assembl y, Templating, Patterning, Microprinting, Solid/Liquid Interfaces, Colloids, Biomimetic, Biomaterials, Free Form Fabrication, Environmentally Friendly Pr ocessings, etc.

The following topics will be covered in several sessions comp romising both invited and contributed papers.

Topics
* Patterning
* Direct Formation of films & Coatings
* Direct Formation of Shaped Materials (Whiskers, Powders)
* Biomimetic
* Self-assembly, Templating
* Electrochemical Films
* Electrodeposition Films
* Films, Electrophoretics, & Pyrolysis
* Porous Structures
* Hybrids & Nano-composites
* Soft Chemistry & Chemical Route
* Fine Powders
* Hydrothermal
* Gel/Sol-Gel

Invited Speakers (tentative)
Jay A. Switzer (Univ. Missouri-Rolla, U. S. A.)
Richard E. Riman (Rutgers Univ., U. S. A.)

Chairpersons
Masahiro Yoshimura¹⁾< /FONT>
Tokyo Institute of Technology, Japan
e-mail: yoshimura@msl.titech.ac.jp
Jay A. Switzer
University of Missouri-Rolla, U. S. A.
e-mail: jswitzer@umr.edu
Richard E. Riman
Rutgers-The State University, U. S. A.
e-mail: riman@email.rci.rutgers.edu
Kiyoshi Okada
Tokyo Institute of Technology, Japan
e-mail: kokada@ceram.titech.ac.jp
Yasuro Ikuma²⁾
Kanagawa Institute of Technology, Japan
e-mail: inorg@chem.kanagawa-it.ac.jp

Organizing Committee (tentative)
M. Abe (Tokyo Inst. Tech.), Ilham A. Aksay (Princeton U.), Y. Awakura (Kyoto U.), K. Byrappa (U. Mysore), Jin-Ho Choy (Seoul Nat'l U.), Ma rk R. De Guire (Case Western Reserve. U.), S. Deki (Kobe U.), K. Domen (Toky o Inst. Tech.), Shu-hua Feng (Jilin U.), Ludwig J. Gauckler (Swiss Fed. Inst . Tech.), K. Ioku (Yamaguchi U.), Y. Ito (Kyoto U.), M. Kakihana (Tokyo Inst . Tech.), Sridhar Komarneni (Penn. State U.), K. Kuroda (Waseda U.), J. Liva ge (U. Pierre Marie Curie), Y. Matsumoto (Kumamoto U.), H. Minoura (Gifu U.) , Y. Moriyoshi (Hosei U.), T. Osaka (Waseda U.), D. A. Payne (U. Illinois Ur bana-Champaign), Yi-Tai Qian (U. Sci. Tech. China), T. Sato (Tohoku U.), Y. Tamaura (Tokyo Inst. Tech.), T. Watanabe (Tokyo Metro. U.), N. Yamasaki (Toh oku U.), K. Yanagisawa (Kochi U.), T. Yao (Kyoto U.), Y. Yokogawa (AIST)