NIMSAWARD2025-abstracts
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P2-271Multi-dimensional microstructure control inNb3Sn superconductorsKey Words: Phase formation, Polycrystalline compoundSuperconducting materials are expected to play a vital role in achieving a carbon-neutral societyand a sustainable, prosperous society, particularly in the development of high-efficiency energy systems and high-field precision measurement technologies.Niobium-tin superconductors are essential materials for high-field magnet applications. ⚫Ti-doping to Nb does not develop multinary compound phase at the interface, which is preferable for promoting Nb3Sn phase formation.⚫Zn addition to Cu matrix achieve both of improvement in the Nb3Sn phase formation and strengthening of the wire simultaneously.ConclusionInfluence of Ti-doping locationRole of Zn addition to Cu matrix⚫By incorporating both element addition methods, we achieve the synergistic effects of both.⚫By industrializing this method, we contribute to realization of DEMO reactor, next generation accelerator and compact high-field NMR magnets.Future PlanIntroductionIn high magnetic field applications such as fusion magnets, the superconductors require high strength performancewhile maintaining high critical current densitycharacteristics. This study addresses this challenge through comprehensive microstructural controlthat modifies not only the superconducting layer but also the matrix simultaneously.Theme underDiscussionAdvanced Superconducting Wire Group, GREEN Nobuya BannoE-mail:: banno.nobuya@nims.go.jpTiNbSnBSETiNbSnBSENb3SnNbSn-CuIn Ti doping to Sn-CuIn Ti doping to Sn-CuNb3SnNbSn-Cu0.92 mm0.92 mmMultinary compound phase forming at the interface between Nb3Sn and Sn-Cu, which suppresses Nb3Sn layer formation.No multinary compound phase at the interface between Nb3Sn and Sn-Cu, which promotes Nb3Sn layer formation.200µmNbCu-15ZnSn-1.6wt%Ti30μm(A)Cu matrixNb3SnNbNb-Sn-Cu-TiCuSn650℃℃x150h30μm(B)Cu-Zn matrixNb3SnNbNb-Sn-Cu-Ti650℃℃x150hZnand Ti adding to Sn-CuNo Zn adding to Sn-CuWhile multinary compound phase forms at the interface between Nb3Sn and Sn-Cu, Nb3Sn layer formation is promoted.No ZnZnaddition0.2% proof strength143 MPa173 MPaCu-15%ZnCuZn remaining in the Cu, which brings about solid-solution strengthening of the matrix. This enables the wire to be made more high-strengthwhile maintaining high critical current density simultaneously.Solid-solution strengthening of the matrix after the reaction

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