NIMS AWARD SYMPOSIUM 2024 | Abstracts
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19On the other hand, to quantitatively assess the reliability and lifespan characteristics of materials, it is essential to fundamentally understand the elementary processes of material fracture and deformation. In this context, in-situ observation and evaluation techniques within (S)TEM are invaluable for observing these elementary processes. We incorporated nanoindentation within TEM and performed dynamic observations of dislocations and microcracks during the fracture and deformation of ceramics. This allowed us to reveal previously unknown elementary processes, such as dislocation motion, dislocation-grain boundary interactions, dislocation emission from crack tips, grain boundary migration, and twin dislocation motion. Recently, we have also succeeded in atomic-level observation of grain boundary migration phenomena induced by electron beams and have developed TEM holders incorporating MEMS technology, enabling the direct observation of fracture and deformation processes at the atomic level. In this presentation, I will also discuss the impact of these cutting-edge aberration-corrected STEM techniques and high-resolution in-situ observation methods on the field of materials science. J. Yan et.al., Nano Letters, 24 (10), 3112-3117 (2024) [1] [2] R Ishikawa et.al., Microscopy, 72 (2), 78-96 (2023) [3] T.Futazuka et.al., Nature Communications, 13(1), 5299, (2022) [4] [5] [6] C.Yang et.al., Acta Mater., 201, 488-493, (2020) [7] D. Yin et.al., Nature Materials, 18[1], 19-23 (2019). [8] S. Kobayashi et al., Nature Communications, 9, 2683 (2018). [9] S. Kondo et al., Science Advances, 2 (11), e1501926 (2016). [10] C. Chen et al., Nature Communications, 6, 6327 (2015). [11] I. Sugiyama et al., Nature Nanotechnology, 8[4], 266-270(2013). [12] N. Shibata et.al., Nature Physics,8[8], 611-615(2012). [13] Z. Wang et,al., Nature,479[7373], 380-383(2011). [14] J. P. Buban et.al., Science, 311[5758], 212-215(2006). [15] Y. Ikuhara, J. Electron Micros., Review paper, 60, S173 -S188 (2011).J.K.Wei et,al., Nature Communications, 13(1), 1455, (2022) J. K. Wei et al., Nature Materials, 20, 951-955(2021).

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