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HOME > 3-D Nano-Integration Foundry > Device and equipment introduction
  Device and equipment introduction
 
Lithography
 
EB lithography system, Laser lithography system, Mask aligner, Plasma asher, UV ozone cleaner
Thin film deposition, Thermal processing
 
12 EB evaporator, Sputter-depo. system, UHV EB evaporator, UHV sputter-depo. system, ALD system, SiO2-PECVD system, RTA system, Thermal oxide and annealing furnace
Dry etching
 
Multipurpose RIE, Compounds RIE, Oxide RIE, Silicon deep RIE
FIB, Measurement
 
FIB–SEM hybrid system, FIB system, FE–SEM, Coating system, AFM, Ellipsometer, Surface profiler, Laser Raman microscope, 3D-measurement laser microscope
Cutting, Polishing, Device characterization
 
Wafer scribing system, Wafer breaking system, CMP system, Manual probe system, Wire bonder, Diamond wire-saw
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