| Thin film processing instruments |
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| Seven targets UHV cosputtering machine |
Six targets UHV rotating-substrate sputtering machine |
Five targets UHV sputtering machie |
10 targets magnetron sputtering machine |
10 targets UHV sputtering machine |
| Thin film processing instruments |
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| 10 targets UHV cosputtering machine |
5 targets magnetron sputtering machine |
Ion Milling for Lithography |
| Physical and magnetic measurement equipments |
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| Point contact Andreev reflection meausurement system |
Vibrating sample magnetometer |
High sensitive VSM
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Differential thermal analysis |
Squid Flux Meter |
| Physical and magnetic measurement equipments |
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| High-field micro-Kerr effect measuring equipment |
Scanning Electron Microscope |
PPMS |
CIPT |
Small Magnet |
| Microfabrication equipments |
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| Electron beam lithography |
Mask Aligner |
Mask Aligner |
Ar ion milling |
Hydraulic press equipment in a magnetic field forming |
| Alloy processing equipments |
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| Vacuum induction furnace |
Arc melting furnace |
Single roll melt spinner |
Arc saction casting machine |
Instron |
| Powder processing apparatus |
Heat treatment equipments |
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| Planetary ball mill |
Vacuum glove box |
Infrared furnace |
Magnetic furnace |
Atmosphere Pressure Furnace |
| TEM specimen preparation apparatus |
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Focused Ion Beam Machines
Hitachi FIB2000 |
Ion Milling
Fishione Model 3000 |
Precision ion polishing system w/cold stage |
Gentle mill |
Carl Zeiss CrossBeam 1540EsB |
| Transmission electron microscopes |
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Tecnai20
(common user facility) |
Technai G2 F30 Lorenz
(common user facility) |
IP reader |
High Intensity Thin Film XRD |
Ion Slicer |
| Three-dimensional atom probes |
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| Laser Assisted Wide Angle TAP |
Energy Compensated 3DAP |
Energy Compensated 3DAP
（Tokai） |
Laser Assisted Energy Compensated 3DAP |
High Resolution Laser Assisted 3D Atom Probe |
